Method of preparing chains for soldering and alpha composition of matter used in such preparation



fI-Io Drawing.

Patented Oct. "1 l, 1932 UNITED. STAT JOHN FILLING-,DF Dep rtme t-esserene, I

METHOD or PREPARING CHAINS non sornnnrlvo 1mm "cemosmcsn ee IvrA rinn' I IN SUCH rnnrartnrrolv This invention relates to a method of pres paring chains for soldering and a composi tion of matter used in such preparation. 'It is intended primarily. to be used with-machine made metal chains. i

Heretofore it has been the custom in making links to use solder filled wire, that is a wire havingacore of soldering material which upon being heated softens and unites the link ends together. Later it has been proposed to make the links of solid wire and deposit upon them by electrolytic action a film of soldering material, after which the links are subjected to heat so that the film of soldering material between the link ends becomes set and binds these ends together. The cost of producing'solid filled wire is high and it is very desirable from the view point of expense to make'the links of solid wire.

But when such links are to be coated with a film of soldering material, it is necessary to take great pains to have the links clean and free from all foreign matter before the soldering material is applied. Moreover when the film of such material has been deposited on the links it leaves them with a surface that may later have to be removed before the jeweler using the chain can plate them as he desires.

Accordingly it is an object of the present invention to employ solid wire links and to prepare themjfor soldering in a manner which can be easily worked and at small expense. In carrying out my method, the chain as it comes from the chain making machine is wound up in skeins or hanks in such lengths as can be conveniently handled. Each hank is then covered with a powdered composition which I prepare by mixing together two parts of tin to one part each of copper and red phosphorus. These ingredients are used in the powdered state, the tin being known as 200 mesh, the copper being almost a fine dust and the red phosphorus being such as is commercially available. 7

When the chain is covered With'the powdered mixture the latter is rubbed into the minute spaces or ends of the links. The powder readily adheres to the chain because the latter When it Application filed; May 7, 1929. s eri 1 1r :*:e ,24'.a

joints between the abutting comes from the chain making machine has a thin filmof oil upon it. The chain is rubbed thoroughly withthe powder until the joints are deemed to be filled therewith after which the excess powder on thesurfa ce of the links isrubbed off. Preferably the chain is sub-, jected to a second bath of the powdered mixture in order to insure the joints being completely filled and so that the additional dry powder and accompanyingrubbing may re move any ofthe first powder that remained on the surface. If the chain when first submltted to the powder was unusually moist, it

a third time,

sufficient.

may be desirable to repeat the powder bath 1 but ordinarily the rubbing of v To further insure that none of the mixture remains on thechaln surface, as distinguished from thejoints, the hank is next rubbed with powdered graphite which has been very slightly moistened with water to '7 cause it to adhere to the chain surface. The.

rubbing is continued until the excess of graphite is removed and only a very thin coating remains on the links, The hanks are then covered with powdered magnesium and further rubbed and finally the hank is dusted with powdered talc. l l

. The hanks are now undone and the chain either laid out in pans or reeled upon frames so that its links are fully exposed. It is now ready for the heat treatment. This can be applied in the same manner as heretofore a practiced with solder filled chains, the de gree of heat and the time of exposure being dependent entirely upon the size and material ofthe chain. the ends of each link are securely soldered together and the surface of the. link is that of the material from which it is made, there being no film or deposit thereon.

Among the advantages ofpreparing chains for soldering as described above are (1) that a chain with. links of solid wire can be treated just as it comesfrom the chain making machine, thus making it unnece sary to clean the chain, (2) the powdered mixture which constitutes the solder is only retained in the joints and therefore there is When properly heated of powdered copper phosphorus.

. "ultimately 10 original links,

'6th day of May,

change in the surface of the and (3) the powdered mixture is relatively inexpens ve and (4) the prepa ration of the chain for soldering can be ac complished tives.- V t What I claim as my invention isz A composition of matter for use in the by relatively unskilled operapreparation of chains for soldering consist; ing of two parts of powdered tin,- one part wr 9f. ed v Rhode Island; this I o JOHN FILLING. i

Signed at Providence, 

